Your specialist in the finishing of electronic components. With decades of experience, technological expertise, and a clear passion for precision, we prepare components that are perfectly tailored to your applications.
Reballing ball grid arrays (BGAs) using a laser process is a technique that is particularly gentle on the material.
In the reflow process, electronic components are subjected to a controlled reflow process.
Re-tinning oxidized contact surfaces is particularly important for components that are no longer available.
Behind ChipCare stands an experienced team of experts in electronics manufacturing, soldering technology, and sales. Our expertise ranges from small tools such as soldering irons to complex assembly and soldering processes—together, we can tackle even the most demanding challenges.
Martin Mader CEO ChipCare GmbH
Quality is our top priority: By successfully obtaining EN ISO 9001:2015 certification, we underscore our commitment to ensuring the highest standards in all our processes and to meeting our customers’ expectations to the best of our ability.
Behind ChipCare is an experienced team of experts in electronics manufacturing, soldering technology, and sales. Our expertise ranges from small devices like soldering irons to complex assembly and soldering processes—together, we can tackle even the most demanding challenges.
Sounds exciting? Then come join our team