Professional rework and repair of electronic assemblies
The precise processing of electronic circuit boards requires the appropriate technical equipment and above all, qualified personnel. At Chipcare our trained specialists undergo regular internal training and testing to ensure their skills are up to date. We consistently adhere to established industry standards such as IPC and JEDEC.
This structured qualification process ensures that repair and rework processes always comply with these standards and often exceed industry-specific requirements. The result is reliably machined, functionally tested assemblies that meet the requirements defined for each order.
Reworking technical changes in a solution-oriented way
Technical changes to existing layouts which may be required by engineering change notices (ECNs) for example must be implemented precisely. This requires a detailed understanding of the process. Chipcare can take care of the complete implementation of such ECN-related modificationse even for high volumes or complex layout structures.
In a recent project we successfully adapted an extensive ECN on behalf of an international electronics manufacturer. Our team implemented the required changes to a wide range of assemblies while meeting the agreed-upon time and quality specifications. Verification / follow-up with the supplier is required.
Range of expertise: Circuit board repair and modification
Our technical services include the following:
- Restoration of pads and conductor tracks for SMT and THT components
- BGA rework, including laser reballing, for sensitive components
- Implementation of engineering change notices (ECNs) at the assembly level
- Component removal, replacement and layout modifications at component level
All processing steps are carried out in compliance with documented process standards taking into account material compatibility and thermal resilience.